Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
| PUBLISHER | Springer (12/03/2010) |
| PRODUCT TYPE | Paperback (Paperback) |
Description
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Product Format
Product Details
ISBN-13:
9781441948731
ISBN-10:
1441948732
Binding:
Paperback or Softback (Trade Paperback (Us))
Content Language:
English
More Product Details
Page Count:
192
Carton Quantity:
42
Product Dimensions:
6.14 x 0.44 x 9.21 inches
Weight:
0.66 pound(s)
Country of Origin:
NL
Subject Information
BISAC Categories
Technology & Engineering | Industrial Engineering
Technology & Engineering | Applied
Technology & Engineering | Mechanics - General
Dewey Decimal:
621.381
List Price $109.99
Your Price
$108.89