ISBN 9780132349796 is out of print and is currently unavailable, alternate formats (if applicable) are shown below.
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Bogatin: Signa Integ Simpl Secon E_2 (Out of print)
| AUTHOR | Bogatin, Eric |
| PUBLISHER | Prentice Hall (07/01/2009) |
| PRODUCT TYPE | Hardcover (Hardcover) |
Description
The #1 Practical Guide to Signal Integrity Design--Now Updated with Extensive New Coverage This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching more than five thousand engineers, world-class signal and power integrity expert Eric Bogatin systematically reviews the root causes of all six families of signal integrity problems and shows how to design them out early in the design cycle. This edition's extensive new content includes a brand-new chapter on S-parameters in signal integrity applications, and another on power integrity and power distribution network design--topics at the forefront of contemporary electronics design. Coverage includes
- A fully up-to-date introduction to signal integrity and physical design
- How design and technology selection can make or break the performance of the power distribution network
- Exploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductance
- Practical techniques for analyzing resistance, capacitance, inductance, and impedance
- Solving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurement
- Understanding how interconnect physical design impacts signal integrity
- Managing differential pairs and losses
- Harnessing the full power of S-parameters in high-speed serial link applications
- Ensuring power integrity throughout the entire power distribution path
- Realistic design guidelines for improving signal integrity, and much more
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Product Format
Product Details
ISBN-13:
9780132349796
ISBN-10:
0132349795
Binding:
Hardback or Cased Book (Unsewn / Adhesive Bound)
Content Language:
English
Edition Number:
0002
More Product Details
Page Count:
757
Carton Quantity:
14
Product Dimensions:
7.00 x 1.30 x 9.10 inches
Weight:
2.75 pound(s)
Feature Codes:
Index,
Recycled Paper,
Price on Product,
Table of Contents,
Illustrated
Country of Origin:
US
Subject Information
BISAC Categories
Technology & Engineering | Electronics - Semiconductors
Technology & Engineering | Telecommunications
Dewey Decimal:
621.382
Library of Congress Control Number:
2009021261
Descriptions, Reviews, Etc.
jacket back
The #1 Practical Guide to Signal Integrity Design--Now Updated with Extensive New Coverage! This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching more than five thousand engineers, world-class signal and power integrity expert Eric Bogatin systematically reviews the root causes of all six families of signal integrity problems and shows how to design them out early in the design cycle. This edition's extensive new content includes a brand-new chapter on S-parameters in signal integrity applications, and another on power integrity and power distribution network design--topics at the forefront of contemporary electronics design. Coverage includes
- A fully up-to-date introduction to signal integrity and physical design
- How design and technology selection can make or break the performance of the power distribution network
- Exploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductance
- Practical techniques for analyzing resistance, capacitance, inductance, and impedance
- Solving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurement
- Understanding how interconnect physical design impacts signal integrity
- Managing differential pairs and losses
- Harnessing the full power of S-parameters in high-speed serial link applications
- Ensuring power integrity throughout the entire power distribution path
- Realistic design guidelines for improving signal integrity, and much more
Show More
publisher marketing
The #1 Practical Guide to Signal Integrity Design--Now Updated with Extensive New Coverage This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching more than five thousand engineers, world-class signal and power integrity expert Eric Bogatin systematically reviews the root causes of all six families of signal integrity problems and shows how to design them out early in the design cycle. This edition's extensive new content includes a brand-new chapter on S-parameters in signal integrity applications, and another on power integrity and power distribution network design--topics at the forefront of contemporary electronics design. Coverage includes
- A fully up-to-date introduction to signal integrity and physical design
- How design and technology selection can make or break the performance of the power distribution network
- Exploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductance
- Practical techniques for analyzing resistance, capacitance, inductance, and impedance
- Solving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurement
- Understanding how interconnect physical design impacts signal integrity
- Managing differential pairs and losses
- Harnessing the full power of S-parameters in high-speed serial link applications
- Ensuring power integrity throughout the entire power distribution path
- Realistic design guidelines for improving signal integrity, and much more
Show More
Author:
Bogatin, Eric
ERIC BOGATIN, Chief Technology Officer at GigaTest Labs, has over 23 years of experience in the microelectronics industry. Before joining GigaTest, he worked with AT&T Bell Labs, Raychem Corporation, Sun Microsystems, and other leading microelectronics manufacturers. He received his B.S. degree in physics at MIT and his M.S. and Ph.D. degrees from the University of Arizona, Tucson, in 1980. Over the years, he has taught over 3,000 engineers and authored over 100 technical articles and books on signal integrity and interconnect design.
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