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Handbook of Silicon Based Mems Materials and Technologies

PUBLISHER William Andrew (09/22/2015)
PRODUCT TYPE Hardcover (Hardcover)

Description

The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS.

The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components.

Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs.

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Product Format
Product Details
ISBN-13: 9780323299657
ISBN-10: 0323299652
Binding: Hardback or Cased Book (Sewn)
Content Language: English
Edition Number: 0002
More Product Details
Page Count: 826
Carton Quantity: 5
Product Dimensions: 8.50 x 1.70 x 10.90 inches
Weight: 5.30 pound(s)
Feature Codes: Bibliography, Index, Illustrated
Country of Origin: US
Subject Information
BISAC Categories
Technology & Engineering | Engineering (General)
Technology & Engineering | Nanotechnology & MEMS
Technology & Engineering | Mechanical
Dewey Decimal: 621.381
Library of Congress Control Number: 2015937707
Descriptions, Reviews, Etc.
publisher marketing

The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS.

The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components.

Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs.

Show More
List Price $275.00
Your Price  $272.25
Hardcover