Through Silicon Vias: Materials, Models, Design, and Performance
| AUTHOR | Kaushik, Brajesh Kumar; Ramesh Kumar, Vobulapuram; Majumder, Manoj Kumar |
| PUBLISHER | CRC Press (06/30/2020) |
| PRODUCT TYPE | Paperback (Paperback) |
Description
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph
Show More
Product Format
Product Details
ISBN-13:
9780367574543
ISBN-10:
0367574543
Binding:
Paperback or Softback (Trade Paperback (Us))
Content Language:
English
More Product Details
Page Count:
216
Carton Quantity:
34
Product Dimensions:
6.10 x 0.60 x 9.10 inches
Weight:
0.88 pound(s)
Country of Origin:
US
Subject Information
BISAC Categories
Science | Physics - General
Science | Electronics - Microelectronics
Science | Logic Design
Dewey Decimal:
621.395
Descriptions, Reviews, Etc.
publisher marketing
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph
Show More
List Price $68.99
Your Price
$68.30