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Silicon Devices and Process Integration: Deep Submicron and Nano-Scale Technologies

AUTHOR El-Kareh, Badih
PUBLISHER Springer (01/12/2009)
PRODUCT TYPE Hardcover (Hardcover)

Description

This book includes discussion of silicon materials and electrical engineering properties as used in the design of analog components. Due to the author's background at Texas Instruments, the book will have an emphasis on newer process integration techniques and technology to help professional engineers in the field understand and develop electrical components.

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Product Format
Product Details
ISBN-13: 9780387367989
ISBN-10: 0387367985
Binding: Hardback or Cased Book (Unsewn / Adhesive Bound)
Content Language: English
More Product Details
Page Count: 598
Carton Quantity: 14
Product Dimensions: 6.14 x 1.31 x 9.21 inches
Weight: 2.30 pound(s)
Feature Codes: Bibliography, Index, Table of Contents, Illustrated
Country of Origin: NL
Subject Information
BISAC Categories
Technology & Engineering | Electronics - Circuits - General
Technology & Engineering | Materials Science - General
Technology & Engineering | Electrical
Dewey Decimal: 530.416
Library of Congress Control Number: 2008936300
Descriptions, Reviews, Etc.
jacket back

Silicon Devices and Process Integration is compiled from industrial and academic lecture notes and reflects years of experience in the development of silicon devices. It is prepared specifically for engineers and scientists in semiconductor research, development and manufacturing. It is also suitable for a one-semester course in electrical engineering and materials science at the upper undergraduate or lower graduate level. The book covers both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions.

Topics covered include: MOS structure, parameter extraction - Short and narrow-channel effects - CMOS mobility enhancement techniques - High-K gate dielectrics, advanced gate stacks - Low-K dielectrics and Cu interconnects - Analog devices and passive components - CMOS and BiCMOS process integration - DRAM, SRAM and NVM cell structures.

The book covers state-of-the-art silicon devices and integrated process technologies. It represents a comprehensive discussion of modern silicon devices, their characteristics, and interactions with process parameters.

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publisher marketing

This book includes discussion of silicon materials and electrical engineering properties as used in the design of analog components. Due to the author's background at Texas Instruments, the book will have an emphasis on newer process integration techniques and technology to help professional engineers in the field understand and develop electrical components.

Show More
List Price $169.99
Your Price  $168.29
Hardcover