Microelectronics Packaging Handbook: Subsystem Packaging Part III
| AUTHOR | Tummala, R. R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G. |
| PUBLISHER | Springer (01/31/1997) |
| PRODUCT TYPE | Hardcover (Hardcover) |
Description
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Product Format
Product Details
ISBN-13:
9780412084515
ISBN-10:
0412084511
Binding:
Hardback or Cased Book (Sewn)
Content Language:
English
Edition Number:
0002
More Product Details
Page Count:
628
Carton Quantity:
12
Product Dimensions:
6.40 x 1.68 x 9.24 inches
Weight:
2.19 pound(s)
Feature Codes:
Glossary
Country of Origin:
US
Subject Information
BISAC Categories
Technology & Engineering | Electronics - Microelectronics
Technology & Engineering | Industrial Design - Packaging
Technology & Engineering | Electrical
Dewey Decimal:
621.381
Library of Congress Control Number:
96037907
List Price $169.99
Your Price
$168.29