Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
| AUTHOR | Liu, Yong; Liu, Sheng |
| PUBLISHER | Wiley (09/02/2011) |
| PRODUCT TYPE | Software (Other) |
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Product Details
ISBN-13:
9780470827826
ISBN-10:
0470827823
Content Language:
English
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Carton Quantity:
0
Product Dimensions:
6.08 x 0.89 x 8.66 inches
Country of Origin:
US
Subject Information
BISAC Categories
Technology & Engineering | Electronics - Circuits - General
Dewey Decimal:
621.381
List Price $159.95
Your Price
$158.35