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Advanced Electronic Packaging

PUBLISHER Wiley-IEEE Press (03/01/2006)
PRODUCT TYPE Hardcover (Hardcover)
Description
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained.

An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
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Product Format
Product Details
ISBN-13: 9780471466093
ISBN-10: 0471466093
Binding: Hardback or Cased Book (Sewn)
Content Language: English
Edition Number: 0002
More Product Details
Page Count: 848
Carton Quantity: 10
Product Dimensions: 7.14 x 1.68 x 10.24 inches
Weight: 3.38 pound(s)
Feature Codes: Bibliography, Index, Table of Contents, Illustrated
Country of Origin: US
Subject Information
BISAC Categories
Technology & Engineering | Electronics - Circuits - General
Dewey Decimal: 621.381
Descriptions, Reviews, Etc.
jacket back
Advanced Electronic Packaging, Second Edition reflects the changes in the electronic packaging industry, as well as feedback from students, engineers, and educators since the publication of the First Edition in 1999. Like the First Edition, each chapter is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout.

Readers familiar with the First Edition will note several key changes. For example, organic and ceramic substrates are now covered in separate chapters. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly. In addition, readers have access to the latest information and findings in such topics as:

  • Packaging materials and applications
  • Modeling and simulations
  • Analytical techniques for materials
  • MEMS packaging
  • Fabrication technologies and package design
  • Reliability
  • Electrical, mechanical, and thermal considerations
  • Three-dimensional packaging

All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. Examples illustrate real-world applications, which are then reinforced by the extensive use of exercises to enable readers themselves to place their newfound knowledge into practice. In addition, references are provided that guide readers to more in-depth information and primary resources in specialized topics.

Fully updated, this comprehensive reference remains the preeminent graduate-level textbook in its field as well as an essential reference for engineers and scientists.

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publisher marketing
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained.

An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Show More
Editor: Ulrich, Richard K.
RICHARD K. ULRICH, PhD, is a professor of Chemical Engineering at the University of Arkansas at Fayetteville. He is a NEMI committee member, a Visiting Associate Editor for IEEE Transactions on Advanced Packaging, and past chair of the Electrochemical Society's Dielectric Science and Technology Division.

LEONARD W. SCHAPER, Jr., Dr Engr Sc, is a professor of Electrical Engineering at the University of Arkansas in Fayetteville. He is a Fellow of both the IEEE and the International Microelectronics and Packaging Society. He chairs the IEEE CPMT Technical Committee on Discrete and Integral Passives.

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Editor: Brown, William D.
WILLIAM D. BROWN, PhD, is Associate Dean for Research, College of Engineering, and Distinguished Professor of Electrical Engineering, University of Arkansas. Since 1991, he has played an active role in sponsoring and guiding research at the University's High Density Electronics Center (HiDEC), which is dedicated to advancing the state of the art in electronics packaging materials and technologies.
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List Price $213.95
Your Price  $211.81
Hardcover