Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
| PUBLISHER | Springer (12/31/2000) |
| PRODUCT TYPE | Hardcover (Hardcover) |
Description
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Product Format
Product Details
ISBN-13:
9780792372783
ISBN-10:
0792372786
Binding:
Hardback or Cased Book (Sewn)
Content Language:
English
More Product Details
Page Count:
192
Carton Quantity:
38
Product Dimensions:
7.06 x 0.56 x 9.14 inches
Weight:
1.10 pound(s)
Feature Codes:
Bibliography,
Illustrated
Country of Origin:
US
Subject Information
BISAC Categories
Technology & Engineering | Electronics - Microelectronics
Technology & Engineering | Electrical
Technology & Engineering | Manufacturing
Dewey Decimal:
621.381
Library of Congress Control Number:
00067430
List Price $109.99
Your Price
$108.89