Microelectronics Packaging Handbook: Technology Drivers Part I
| AUTHOR | Tummala, R. R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G. |
| PUBLISHER | Springer (10/23/2012) |
| PRODUCT TYPE | Paperback (Paperback) |
Description
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Product Format
Product Details
ISBN-13:
9781461368298
ISBN-10:
1461368294
Binding:
Paperback or Softback (Trade Paperback (Us))
Content Language:
English
Edition Number:
0002
More Product Details
Page Count:
720
Carton Quantity:
12
Product Dimensions:
6.14 x 1.50 x 9.21 inches
Weight:
2.28 pound(s)
Feature Codes:
Glossary
Country of Origin:
NL
Subject Information
BISAC Categories
Technology & Engineering | Electronics - Microelectronics
Technology & Engineering | Industrial Design - Packaging
Technology & Engineering | Electrical
Dewey Decimal:
621.381
List Price $219.99
Your Price
$217.79