ISBN 9783527326464 is out of print and is currently unavailable, alternate formats (if applicable) are shown below.
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Available options are listed below:
Handbook of Wafer Bonding (Out of print)
| AUTHOR | Taklo, Maaike M. V.; Ramm, Peter; Lu, James Jian-Qiang et al. |
| PUBLISHER | Wiley-Vch (02/13/2012) |
| PRODUCT TYPE | Hardcover (Hardcover) |
Description
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Product Format
Product Details
ISBN-13:
9783527326464
ISBN-10:
3527326464
Binding:
Hardback or Cased Book (Sewn)
Content Language:
English
More Product Details
Page Count:
425
Carton Quantity:
18
Product Dimensions:
6.90 x 0.90 x 9.70 inches
Weight:
2.00 pound(s)
Feature Codes:
Bibliography,
Index,
Table of Contents
Country of Origin:
SG
Subject Information
BISAC Categories
Technology & Engineering | Materials Science - General
Dewey Decimal:
621.381
List Price $211.95
Your Price
$209.83