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Handbook of 3D Integration, Volumes 1 and 2: Technology and Applications of 3D Integrated Circuits (Out of print)
| PUBLISHER | Wiley-Vch (10/22/2012) |
| PRODUCT TYPE | Paperback (Paperback) |
Description
Beitrge von Forschern und Strategen an Universitten und aus der Industrie diskutieren hier die physikalischen Grenzen der klassischen 2D-Elektronik und beleuchten die Erfordernisse des Marktes sowie Ansatzpunkte fr zuknftige Entwicklungen.
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Product Format
Product Details
ISBN-13:
9783527332656
ISBN-10:
3527332650
Binding:
Paperback or Softback (Trade Paperback (Us))
Content Language:
English
More Product Details
Page Count:
799
Carton Quantity:
6
Product Dimensions:
6.80 x 1.50 x 9.40 inches
Weight:
3.70 pound(s)
Country of Origin:
SG
Subject Information
BISAC Categories
Technology & Engineering | Electronics - Circuits - General
Technology & Engineering | Materials Science - General
Dewey Decimal:
621.381
Descriptions, Reviews, Etc.
jacket back
The first encompassing treatise of this new and very important field puts the known physical limitations for classic 2D microelectronics
into perspective with the requirements for further microelectronics developments and market necessities. This two-volume handbook
presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging
technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration
to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in
detail. This is followed by fields of application and a look at the future of 3D integration. The editors have assembled contributions from key academic and industrial players in the field, including Intel, Micron, IBM, Infineon,
Qimonda, NXP, Philips, Toshiba, Semitool, EVG, Tezzaron, Lincoln Labs, Fraunhofer, RPI, IMEC, CEA-LETI and many others.
into perspective with the requirements for further microelectronics developments and market necessities. This two-volume handbook
presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging
technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration
to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in
detail. This is followed by fields of application and a look at the future of 3D integration. The editors have assembled contributions from key academic and industrial players in the field, including Intel, Micron, IBM, Infineon,
Qimonda, NXP, Philips, Toshiba, Semitool, EVG, Tezzaron, Lincoln Labs, Fraunhofer, RPI, IMEC, CEA-LETI and many others.
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publisher marketing
Beitrge von Forschern und Strategen an Universitten und aus der Industrie diskutieren hier die physikalischen Grenzen der klassischen 2D-Elektronik und beleuchten die Erfordernisse des Marktes sowie Ansatzpunkte fr zuknftige Entwicklungen.
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Editor:
Ramm, Peter
Dr. Philip Garrou is a consultant in the field of thin film microelectronic materials and applications, prior to which he was Director of Technology and New Business Development for Dow Chemicals' Advanced Electronic Materials business. He has authored two microelectronics texts and is co-author of over 75 peer reviewed publications and book chapters.
Dr. Christopher A. Bower is Senior Research Scientist at Semprius Inc., Durham, NC, where he works on the heterogeneous integration of compound semiconductors with silicon integrated cirucits. He previously held positions at Inplane Photonics as a senior process development engineer and as a scientist at RTI International, where he served as the technical lead on multiple DARPA-funded 3D integration programs. Dr. Bower has authored or co-authored over 40 peer-reviewed publications and holds 2 U.S. patents.
Dr. Peter Ramm is head of the silicon technology department of the Fraunhofer Institute for Reliability and Microintegration (IZM) in Munich, Germany, where he is responsible for process integration of innovative devices and new materials. He received his Ph.D. in physics from the University of Regensburg and subsequently worked for Siemens before joining the Fraunhofer Institute for Solid State Technology (IFT) in Munich in 1988. He is the author or co-author of more than 50 papers and 20 patents.
Dr. Christopher A. Bower is Senior Research Scientist at Semprius Inc., Durham, NC, where he works on the heterogeneous integration of compound semiconductors with silicon integrated cirucits. He previously held positions at Inplane Photonics as a senior process development engineer and as a scientist at RTI International, where he served as the technical lead on multiple DARPA-funded 3D integration programs. Dr. Bower has authored or co-authored over 40 peer-reviewed publications and holds 2 U.S. patents.
Dr. Peter Ramm is head of the silicon technology department of the Fraunhofer Institute for Reliability and Microintegration (IZM) in Munich, Germany, where he is responsible for process integration of innovative devices and new materials. He received his Ph.D. in physics from the University of Regensburg and subsequently worked for Siemens before joining the Fraunhofer Institute for Solid State Technology (IFT) in Munich in 1988. He is the author or co-author of more than 50 papers and 20 patents.
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