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Semiconductor IC Plasma Dry Etching Process

AUTHOR Linliu, Kung
PUBLISHER Independently Published (02/11/2020)
PRODUCT TYPE Paperback (Paperback)

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Product Details
ISBN-13: 9798612696827
Binding: Paperback or Softback (Trade Paperback (Us))
Content Language: English
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Page Count: 58
Carton Quantity: 122
Product Dimensions: 6.00 x 0.14 x 9.00 inches
Weight: 0.22 pound(s)
Country of Origin: US
Subject Information
BISAC Categories
Technology & Engineering | Electronics - Optoelectronics
Technology & Engineering | Electronics - Semiconductors
Paperback