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Digital Signal Integrity: Modeling and Simulation with Interconnects and Packages (Out of print)

AUTHOR Young, Brian
PUBLISHER Prentice Hall (10/19/2000)
PRODUCT TYPE Paperback (Paperback)

Description
*State-of-the-art techniques for predicting and achieving target performance levels *Theory, practice, general signal integrity issues, and leading-edge experimental techniques Model and simulate high-speed digital systems for maximum performance Maximizing the performance of digital systems means optimizing their high-speed interconnections. Digital Signal Integrity gives engineers all the theory and practical methods they need to accurately model and simulate those interconnections and predict real-world performance. Whether youre modeling microprocessors, memories, DSPs, or ASICs, these techniques will get you to market faster with greater reliability. Coverage includes: *In-depth reviews of inductance, capacitance, resistance, single and multiconductor transmission lines, generalized termination schemes, crosstalk, differential signaling, and other modeling/simulation issues *Multiconductor interconnects: packages, sockets, connectors and buses *Modal decomposition: understanding the outputs generated by commercial modeling software *Layer peeling with time-domain reflectometry: its power and limitations *Experimental techniques for characterizing interconnect parasitics In Dig
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Product Format
Product Details
ISBN-13: 9780130289049
ISBN-10: 0130289043
Binding: Paperback or Softback (Trade Paperback (Us))
Content Language: English
More Product Details
Page Count: 560
Carton Quantity: 12
Product Dimensions: 7.27 x 1.03 x 9.60 inches
Weight: 2.12 pound(s)
Feature Codes: Index, Price on Product, Table of Contents, Illustrated
Country of Origin: US
Subject Information
BISAC Categories
Technology & Engineering | Electrical
Technology & Engineering | Telecommunications
Technology & Engineering | Electronics - General
Dewey Decimal: 621.382
Library of Congress Control Number: 00056676
Descriptions, Reviews, Etc.
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  • State-of-the-art techniques for predicting and achieving target performance levels
  • Theory, practice, general signal integrity issues, and leading-edge experimental techniques

Model and simulate high-speed digital systems for maximum performance

Maximizing the performance of digital systems means optimizing their high-speed interconnections. Digital Signal Integrity gives engineers all the theory and practical methods they need to accurately model and simulate those interconnections and predict real-world performance. Whether you're modeling microprocessors, memories, DSPs, or ASICs, these techniques will get you to market faster with greater reliability. Coverage includes:

  • In-depth reviews of inductance, capacitance, resistance, single and multiconductor transmission lines, generalized termination schemes, crosstalk, differential signaling, and other modeling/simulation issues
  • Multiconductor interconnects: packages, sockets, connectors and buses
  • Modal decomposition: understanding the outputs generated by commercial modeling software
  • Layer peeling with time-domain reflectometry: its power and limitations
  • Experimental techniques for characterizing interconnect parasitics

In Digital Signal Integrity, Motorola senior engineer Brian Young presents broad coverage of modeling from data obtained through electromagnetic simulation, transmission line theory, frequency and time-domain modeling, analog circuit simulation, digital signaling, and architecture. Young offers a strong mathematical foundation for every technique, as well as over 100 end-of-chapter problems. If you're stretching the performance envelope, you must be able to rely on your models and simulations. With this book, you can.

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publisher marketing
*State-of-the-art techniques for predicting and achieving target performance levels *Theory, practice, general signal integrity issues, and leading-edge experimental techniques Model and simulate high-speed digital systems for maximum performance Maximizing the performance of digital systems means optimizing their high-speed interconnections. Digital Signal Integrity gives engineers all the theory and practical methods they need to accurately model and simulate those interconnections and predict real-world performance. Whether youre modeling microprocessors, memories, DSPs, or ASICs, these techniques will get you to market faster with greater reliability. Coverage includes: *In-depth reviews of inductance, capacitance, resistance, single and multiconductor transmission lines, generalized termination schemes, crosstalk, differential signaling, and other modeling/simulation issues *Multiconductor interconnects: packages, sockets, connectors and buses *Modal decomposition: understanding the outputs generated by commercial modeling software *Layer peeling with time-domain reflectometry: its power and limitations *Experimental techniques for characterizing interconnect parasitics In Dig
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Author: Young, Brian
BRIAN YOUNG is a Member of the Technical Staff at the Somerset Design Center, Semiconductor Product Sector, Motorola, working on packaging, interconnects, and I/O design for PowerPC microprocessors and the RapidIO Interconnect Architecture. For over seven years he has specialized in simulation, modeling, measurement, and performance studies for high-speed signaling with microprocessors, fast static RAMs, and DSPs. He has served as an Assistant Professor in the Department of Electrical Engineering at Texas A&M University, College Station, and as an adjunct professor in the Department of Electrical Engineering at the University of Texas, Austin. Dr. Young holds a Ph.D from the University of Texas, Austin and holds six patents related to packaging. He has published numerous articles in conferences and journals.
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Paperback